METI to Provide up to ¥45 Bil. for Development of Cutting-Edge Chips; Subsidizing Research and Development Costs
In a significant move to bolster advancements in semiconductor technology, the Japanese government has unveiled a financial support plan amounting to up to ¥45 billion. This initiative is aimed at the Leading-edge Semiconductor Technology Center (LSTC) based in Tokyo, marking a bold step towards the development of next-generation semiconductors. The strategy orchestrated by the Economy, Trade and Industry Ministry is designed to enhance the design of semiconductors specifically tailored for artificial intelligence and to accelerate the research and development of pioneering products.
The LSTC, a conglomerate of research institutes and universities, boasts notable members including the National Institute of Advanced Industrial Science and Technology, the University of Tokyo, and the government-supported chip manufacturer Rapidus Corp. In an ambitious move, the industry ministry plans to cover all research and development costs incurred by the LSTC for a duration of up to five years.
The financial backing is predicated on the expectation that Rapidus will lead the charge in semiconductor manufacturing within Japan, bringing to life the vision of producing state-of-the-art semiconductors domestically. A substantial portion of the fund, amounting to up to ¥28 billion, will be directed towards developing the requisite technology for the manufacture of 2-nanometer-class semiconductors. These advanced semiconductors are envisioned for artificial intelligence applications and are touted for their rapid data processing capabilities. To achieve this, LSTC plans to form an international collaborative framework with Tenstorrent, a Canadian startup renowned for designing and developing semiconductors dedicated to AI.
Furthermore, the ministry’s financial aid encompasses up to ¥17 billion earmarked for the crafting of next-generation semiconductors that surpass the finesse of 2 nanometers. The progression to finer line widths in semiconductor circuits is directly proportional to the enhancement of the chip’s processing prowess. This provision for subsidies is crafted to spur a comprehensive research and development effort, encapsulating both the exploration of new materials and the advancement of manufacturing equipment.
During a press conference held on Friday, LSTC President Tetsuro Higashi elaborated on the center’s forward-looking agenda, “We will promote the development of advanced semiconductors through collaboration with research institutions in the U.S. and Europe.” This declaration underscores the international dimension of LSTC’s approach towards achieving its semiconductor development objectives, signaling a concerted effort to push the boundaries of technology in collaboration with global partners.
The Japanese government’s commitment to this significant financial outlay reflects a strategic investment in the future of semiconductor technology. By nurturing the development of cutting-edge chips crucial for artificial intelligence and beyond, Japan is positioning itself as a key player in the global push towards technological innovation and supremacy in the semiconductor industry.
